Launching the most recent premium application processor (AP), the Exynos 9 Series 9810, Samsung Electronics said that it will be a “key catalyst” for smart platforms in the coming era of AI.
Built on the company’s second-generation 10-nanometer (nm) FinFET process, the Exynos 9 Series 9810 features faster gigabit LTE modem and sophisticated image processing with deep learning-based software. Due to the powerful third-generation custom CPU, it brings the next level of performance to smartphones and smart devices.
Ben Hur, VP of System LSI marketing at Samsung Electronics, said, “The Exynos 9 Series 9810 is our most innovative mobile processor yet, with our third-generation custom CPU, ultra-fast gigabit LTE modem and, deep learning-enhanced image processing. The Exynos 9810 will be a key catalyst for innovation in smart platforms such as smartphones, personal computing and automotive for the coming AI era.”
The Exynos 9 Series 9810 will be on display at CES 2018 in Las Vegas, NV, from January 9 to 12. The product is also selected as a CES 2018 Innovation Awards HONOREE in the Embedded Technologies product category.
Alongside this, Samsung Electronics announced Open Connectivity Foundation (OCF) 1.3 certification for the Samsung ARTIK 05x series of modules. ARTIK 05x series is the first system-on-module family to be certified using new OCF standards for trust and connectivity for IoT. The ARTIK 05x series allows enterprises to build Wi-Fi enabled edge products that meet OCF standards for interoperability. With ARTIK platform’s built-in hardware and software solutions companies can ensure reliability, safety and privacy for their connected products.